Computational explorations in magnetron sputtering pdf

Apr, 20 the planar magnetron is, in essence, a classic diode mode sputtering cathode with the addition of a permanent magnet array behind the cathode. The electrons follow helical paths around the magnetic field lines undergoing more ionizing collisions with neutral gaseous near the target than would otherwise occur. Comsol conference rotterdam 20 october 2325, 20 introduction the magnetron sputtering process operated in vacuum chamber typical pressure. Reactive magnetron sputter deposition and characterization. Magnetron sputtering deposition magnetron sputtered thin films. Deposition of nanostructured cuti based films by advanced. The spokes in rfms were compared to the spokes in classical dc magnetron sputtering dcms at similar discharge conditions. Pdf magnetron sputtering is a widely used industrial process for depositing thin films. This overview article will deal with a special application of the sputtering process, namely, the magnetron sputtering technique. Greene 2 1 ghent university, department of solid state sciences, krijgslaan 281 s1, 9000 ghent, belgium 2 materials science and physics departments and the frederick seitz materials. Hipims was introduced by kouznetsov etal11 and has been extensively studied ever since 1214.

Magnetron sputtering is one of welldeveloped method for thin film fabrication but its extensive use in industrial application depends on the ability of obtaining high quality films with high value of deposition rate on a large deposition area. This magnet array is arranged so that the magnetic field is normal to the electric field in a closed path and forms a boundary tunnel which traps electrons near the surface of the target. New perkin elmer sputtering deposition system perkinelmer 4400,4410,4450,4480. Nanotechnologies play a prominent role in these research fields. Piezoelectric adjustable xray optics use magnetron sputtered thin film. Magnetron sputtering deposition magnetron sputtered thin. Magnetron sputtering ms is an established plasma technology for the.

Magnetron sputtering overview angstrom engineering. Price comparison 0692289925 9780692289921 computational explorations in magnetron sputtering. It is widely used in the optical and architectural glass industries. The work was supported by the swedish research council vr and the swedish foundation for strategic research. Table 1 gives an overview of the most important compound films. Principle of the magnetron sputtering process 10 magnetron sputtering deposition techniques are widely applied both in industrial processes and in advanced material development or treatment 11. Aeres, angstroms advanced process control software, has been specifically configured with features and capabilities unique to high performance rf magnetron sputter. Magnetron sputtering is a typical method of physical vapor deposition.

Magnetron sputtering is a highrate vacuum coating technique that allows the deposition of many types of materials, including metals and ceramics, onto as many types of substrate materials by the use of a specially formed magnetic field applied to a diode sputtering target. This thesis introduces a microsputtering method to directly write metals with. Cavity shaped magnetron sputtering cathode a niobium ring, 48. Design, construction, and optimization of a magnetron. Magnetron sputtering especially closedfield unbalanced magnetron configuration has gained wide acceptance in both research and commercial purposes and is routinely used in different industries. Computational explorations in magnetron sputtering. The book computational explorations in magnetron sputtering by e. The combined expertise in nanofabrication, materials and photonics creates a synergy able to compete in this very new and challenging field. The author describes magnetron sputtering in several chapters starting with the design of magnets in the magnetron, plasma physics, sputtering process and ultimately to the deposition of thin films. A high power impulse magnetron sputtering model to explain. Sputtering magnetron design from angstrom science is a key benefit of all of our custom magnetrons from circular to linear to cylindrical. Particle motion during magnetron sputter deposition digital wpi.

Paper open access related content magnetic thin film. From equation 35, the field varies linearly with distance from the target. Magnetron sputtering is a plasma vapor deposition pvd process in which a plasma is created and positively charged ions from the plasma are accelerated by an electrical field superimposed on the negatively charged electrode or target. New magnetron configurations for sputtered nb onto cu. The right combination of e and b fields will trap the electrons near the target surface, creating high electron densities and consequently high sputter rates. The main aim of ifn is the study and fabrication of advanced devices for photonics, optoelectronics and electronics. Greene 2 1 ghent university, department of solid state sciences, krijgslaan 281 s1, 9000 ghent, belgium 2 materials science and physics departments and the frederick seitz materials research laboratory, university of illinois, urbana, illinois 61801, usa sputter deposition is a widely used technique to deposit thin films on substrates. Related content timeresolved measurement of film growth during highpower pulsed magnetron sputtering hppms of titanium.

It is utilized to make both single layer and multilayer thin films. Magnetron sputtering magnets enable lower pressures to be used during the sputter process a magnetic field can be used to trap secondary electrons close to the target. It is featured with very high peak power on the target. In case of large deposition are, the film uniformity play a. However, many applications in various industrial fields also need oxides, nitrides, or carbides. This eliminates the need for construction of expensive compound targets or the use of highly volatile gases. Designing magnetron sputtering configurations for lg problem description magnetron sputtering is used as a plasma processing technique to deposit very thin films onto a substrates for a wide variety of commercial manufacturing and scientific purposes in areas such as optics, electronics and packaging. Magnetron sputtering since film morphology is strictly correlated to the deposition angle and electrical and superconducting film properties degrade vs.

In general, three types of potential can be applied. Magnetron sputtering of metals is not a big challenge if the target surface is clean and proper process conditions base pressure, process pressure, and power are applied. May 29, 2019 selforganized plasma structures, called spokes, have been previously reported for continuous and pulsed magnetron discharges. Sputtered atoms ejected from the target have a wide energy distribution. Magnetron sputtering overcomes these problems and has many other advantages. For magnetic materials such as fe iron, ni nickel, or co cobalt, dc magnetrons can be configured with magnets specifically selected for generating plasma within. Co sputtering is where two or more target materials are sputtered at once in the vacuum chamber and is often used with reactive magnetron sputtering to produce thin films that are compounds such as alloys or composites. Computational explorations in magnetron sputtering e. Combinatorial rf magnetron sputtering for rapid materials.

The magnetic field is produced by a 2 cm high ndfeb. Reactive magnetron sputtering enables the deposition of various thin films to be 19 used for protective as well as optical and electronic applications. Sussex, uk of crucial importance to the thin film process engineer is an understanding of the parameters which affect the film. To ensure our solution is accurate, we should confirm that energy is conserved. Sputtering magnetron design custom circular linear. Introduction to magnetron sputtering micro magnetics. Magnetron sputtering is a highrate vacuum coat ing technique for depositing metals, alloys and compounds onto a wide range of materials with thicknesses up to about 5pm. However, progressing target 20 erosion during sputtering results in increased magnetic field strengths at the target surface. Interest in this technology has sparked two previous explorations into microsputtering. Magnetron sputtering physics and design springerlink. Ruzic university of illinois at urbana champaign, urbana, illinois 61801, usa received 21 june 2016. Among these is a process called sputtering that has. Arnell centre for advanced materials and surface engineering, university of salford, salford m5 4wt, uk received 20 september 1999 abstract magnetron sputtering has become the process of choice for the deposition of a wide range of industrially important. Pdf computational explorations in magnetron sputtering.

Mcinerney, computational explorations in magnetron sputtering. Selforganizing plasma behavior in rf magnetron sputtering. Computational simulations of electron orbits b e 1 0 ni m figure 2. Technical illustration of magnetron sputtering technology. Selforganizing plasma behavior in rf magnetron sputtering discharges.

Custom magnetron designs are why so many oems turn to angstrom sciences. Magnetron sputtering an overview sciencedirect topics. The technique is typically classified by the type of electric potential that is supplied to the cathode. The initial design was for a smaller system when deliberations for a new mbe system were still underway. Pvd films are found in everything from the moisture barriers in potato chip bags to the interconnects of modern semiconductor devices. It exhibits several important advantages over other vacuum coating. In both regimes, stable plasma patterns were observed for a wide range of discharge parameters. Thickness distribution of sputtered films on curved substrates for. The russian market for metallized packaging, for example, is only beginning to develop, and approximately 80 percent of metallized films and nearly 100 percent of metallized paper is imported from other countries. Npre to design and construct a magnetron sputtering system for urania deposition.

Techx designing magnetron sputtering configurations for lg. Magnetic field strength influence on the reactive magnetron. Rf sputtering is a suitable technique to fabricate optical planar waveguides and photonic microcavities operating in the visible and nir regions. This eliminates the need for construction of expensive compound targets or. The use of magnetron sputtering in coating technology was first proposed by f. Although the basic sputtering process has been known and used for many years, it is the development of the unbalanced magnetron and its incorporation into.

The sputtering unit is a custombuilt ultrahigh vacuum uhv chamber. Computational explorations in magnetron sputtering from. Magnetron sputtering technology basic sputtering process there are many different ways to deposit materials such as metals, ceramics, and plastics onto a surface substrate and to form a thin film. This book walks you through the physics of magnetron sputtering in a stepbystep fashion. Tftlcd technology makes use of tco materials predominantly ito to provide the transparent electrode on the front side of the lcd pixel. Rf magnetron sputtering is available in a variety of source configurations and compatible with many of angstroms process control capabilities and advanced fixturing options. Magnetron sputtering ms is an established plasma technology for the fabrication of highquality thin films. Discovery of new materials using combinatorial synthesis. Studying target erosion in planar sputtering magnetrons. Epitaxial growth has shown to be a useful synthesis route for the ti2aln and sc3aln phases. These designs were reexamined and ultimately changed in favor of a more robust magnetron.

Circular magnetrons are more commonly found in smaller scale confocal. Technological applications of thin films obtained with magnetron sputtering in sputtering there are two means of operation. There are two threeinch magnetron guns and a clusterflange which contains three twoinch guns with a coincidental focus. Schematics of a rectangular magnetron sputtering system. Studying target erosion in planar sputtering magnetrons using.

Modeling reactive magnetron sputter deposition using the. On electron heating in magnetron sputtering discharges. We used an intensified chargecoupled device camera and electrical probes to investigate the rotating plasma patterns. Findings from thinfilm mls explorations can also be transferred to bulk e.

On electron heating in magnetron sputtering discharges introduction the majority of the ionization events occur in this region where the energetic electrons are trapped in the presence of an electric. The magnetron sputtering process operated in vacuum chamber typical pressure. Rectangular magnetrons are most often found in larger scale in line magnetron sputtering systems where substrates scan linearly past the targets on some form of conveyor belt or carrier. Computational simulations on electron orbits in the. In order to understand the underlying physical processes behind magnetron sputtering, a brief recapitulation of the sputtering phenomena will be given as a primary contribution of this article. Magnetron sputtering plasma based technique a magnetically confined plasma is generated in front of the cathode target sputtering ions are direct towards the cathode collisions cascade leads to ejection of atomstransport atoms are transported in gas phasedeposition film growth reactive and nonreactive deposition. May 29, 2019 magnetron sputtering ms is an established plasma technology for the fabrication of highquality thin films. Pvd films are found in everything from the moisture. Dc sputtering magnetron sputtering using dc power is an effective and economical choice for depositing conductive materials such as metals or transparent conductive oxides tcos. Pvd process used for depositing materials onto a substrate, by ejecting atoms from such materials and condensing the. Reactive magnetron sputter deposition and characterization of. Resputtering is reemission of the deposited material during the deposition process by ion or atom bombardment. Several different magnetron sputtering cathodetarget shapes have been used, but the most common are circular and rectangular.

At any given point the total energy of the electron consists of its kinetic energy and its potential energy. Magnetron sputtering is a widely used industrial process for depositing thin films. A high power impulse magnetron sputtering model to explain high deposition rate magnetic field configurations priya raman, justin weberski, matthew cheng, ivan shchelkanov, and david n. Sputter deposition is a physical vapor deposition pvd method of thin film deposition by sputtering. Pvd rf sputtering coating principle magnetron sputter. Mls fabrication by combinatorial magnetron sputter processes, e. Mcinerney focuses on the modeling of sputtering process in magnetrons.

Rotary magnetron rotary cathode sputtering technology is broadly used in display manufacturing, both for rigid and flexible display applications. This involves ejecting material from a target that is a source onto a substrate such as a silicon wafer. May 22, 2015 new perkin elmer sputtering deposition system perkinelmer 4400,4410,4450,4480. Magnetron sputterer accelerated maturation of materials. Magnetron sputtering is a deposition technology involving a gaseous plasma which is generated and confined to a space containing the material to be deposited the target. Investigation and optimization of the magnetic field. Sputtering technique in sputtering deposition technique magnets are added. The latter comes about from its position in the electric field.

Magnetron sputter deposition is a plasmaassisted material transfer process. The primary advantages are 1 high deposition rates, 2 ease of sputtering any metal, alloy or compound, 3 highpurity films, 4 extremely high adhesion of films, 5 excellent coverage of steps and small. The main line of development of magnetron sputtering up to the present time has been associated with the transition to planar magnetron sputtering systems in the 70s of the past century. Armed with the knowledge gained from this study, further explorations of magnet strength and. Film thickness distribution in magnetron sputtering s swarm, edwards high vacuum international, manor royal, crawley, w. Magnetron sputtering technology the domestic production of metallized textiles, films and paper holds considerable promise.

Magnetron sputtering has proven to be a very useful deposition and etching technique in many spheres for several reasons, among which are the low heating effect and minimal damage caused to delicate substrates, the ability to cope with almost any metal or alloy, and indeed many insulating materials when reactive or radio frequency r. Cosputtering is where two or more target materials are sputtered at once in the vacuum chamber and is often used with reactive magnetron sputtering to produce thin films that are compounds such as alloys or composites. Here, we demonstrate that spokes also form in the oscillatory rf magnetron sputtering rfms regime. The surface of the target is eroded by highenergy ions within the plasma, and the liberated atoms travel through the vacuum environment and deposit onto a substrate. Sputtering techniques are widely used in industrial process because high quality films can be obtained at low temperature substrates. Ruzic university of illinois at urbana champaign, urbana, illinois 61801, usa.

Starting with the magnetic fields crucial to efficient operation, the book then looks. Film thickness distribution in magnetron sputtering. Computational simulations on electron orbits in the magnetron. Combinatorial rf magnetron sputtering for rapid materials discovery.

1281 67 698 778 393 253 634 1043 1 1057 1164 139 685 153 806 864 352 576 620 826 1258 1561 1216 177 353 567 138 740 1318 31 101 610 470 46 1045 1151